Semiconductor Bonding Materials

NIPPON STEEL Chemical & Material is committed to offering the most advanced technologies to meet the challenge of rapidly increasing high-integration, high-density IC requirements. We taking advantage of strong links with Advanced Technology Research Laboratories(NSSMC), provides customers with superior bonding wire and microball products, through its affiliate, Nippon Micrometal.

Bonding Materials
Bonding Materials

Copper Bonding Wire

Copper bonding wire, as a material alternative to expensive gold bonding wire, permits substantial cost reduction. The EX Series is a next-generation bonding wire that offers compatibility between attractive pricing and steady levels of productivity-and it can also serve as a high-function PKG.

  • Bonding operation requires only N2 gas
  • Long spooled length like gold wires (No Sealing Bag needed)
EX1 Wire(Copper Bonding Wire)
EX1 Wire(Copper Bonding Wire)
EX1 use for fine IC Package(EX1-φ18μm)
EX1 use for fine IC Package
Cu Bonding Wire Detailed data

Gold Bonding Wire

The purity of gold is 99.99%. NIPPON STEEL Chemical & Material has enhanced the strength, loop shape controllability, bond reliability, etc., by improving the trace additive and the processing.


Corresponded to various semiconductor mounting from a general-purpose semiconductor to the CSP mounting.

  • for longer spans, shorter spans
  • for fine pitches
  • for smaller wire diameter
  • for low, medium / high, and high loop operation

φ15μm~50μm(Ave. φ25μm)

Wire connected at 35μm pitch
Wire connected at 35μm pitch
Au Bonding Wire Detailed data

For Details, Please Contact

Nippon Micrometal Corporation

Go Page Top