Micron Division, for the first time in the world, met the need for high-performance encapsulation material by the development of producing ceramic spherical fine particle by flame spray method. By high sphericity and high purity, the products have since steadfastly protected the reliability of semiconductors which are growing increasingly high in density and function.
Micron Division has then developed spherical fine particle of alumina. Its spherical fine particle of alumina, in addition to high sphericity and high-precision particle-size control, are capable of exhibiting unique performance, with the advantages of heat resistance, hardness, thermal conduction and other characteristics of alumina.
Silica filler is used mainly as sealing filler for silicon chips of ICs. The silica filler has excellent properties, such as very low coefficient of thermal expansion, high fluidity, high packing density, and reduced damage to the material in contact when it is packed.
Demand for this material is expected in applications where characteristics such as thermal stability under high temperature, or sphericity and high-temperature conductivity among ceramic particles, are required.
