NIPPON STEEL Chemical & Material is committed to offering the most advanced technologies to meet the challenge of rapidly increasing high-integration, high-density IC requirements. We taking advantage of strong links with Advanced Technology Research Laboratories(NSSMC), provides customers with superior bonding wire and microball products, through its affiliate, Nippon Micrometal.
Copper bonding wire, as a material alternative to expensive gold bonding wire, permits substantial cost reduction. The EX Series is a next-generation bonding wire that offers compatibility between attractive pricing and steady levels of productivity-and it can also serve as a high-function PKG.
EX wire is a de facto standard Pd coated Cu (PCC) wire in worldwide market with attractive cost saving and stable productivity.
We are the world leading company of PCC wire and developing a wide range of product lineups to meet the various market needs.
GX2 series an innovative Ag alloy wire that achieves excellent long-term reliability and low electrical resistivity simultaneously.
It has a comparable bondability and soft FAB as in Au wire,thus applicable to weak pad structure. It is well suited for various applications from stacked memory, LED, and to high reliability automotive packages. GX2 series realizes an attractive cost reduction from conventional Au wire.
Our bare Cu wires (BX series) are characterized by longer floor life and higher bondability compared with conventional bare Cu wire.
They are available in various diameters from fine diameters for general purposes to very thick diameters for power device application.
Various types of Au wires are available. They will let you challenge the limit of bonding technology, such as finer diameter, finer bond pitch, and longer loop span.
NL1 realizes a wider bonding process window than conventional Al wires. It is characterized by wide process window and high corrosion resistance, and well suited for a wide variety of applications from power electronics, automotive electronics, and to battery connections.
